Intel has long dominated the x86 architecture based server and PC processor market through the IDM model. At the same time, it acts as a pioneer in the semiconductor industry’s process miniaturization according to Moore’s Law. Yet, in recent years, Intel has seen continued delays in the development of 10nm and 7nm technologies. At the same time, in the ARM architecture based SoC processor market, customers can continuously and steadily obtain higher performance, lower power consumption, and more cost efficient IC design and manufacturing services through the continuous technological breakthroughs of TSMC at 10/7/5nm or even 3nm, integrated with the TSMC-led Open Innovation Platform (OIP), process and design-technology co-optimization (DTCO), and 3DFabric advanced packaging services. In addition to Apple leading the world in releasing the most advanced AP-SoC mobile processors, AMD’s PC processor market share on the client side is gradually threatening Intel. At the same time, the supply stability of the AMD Graphic and Data Center also trumps Intel and Nvidia. Furthermore, Apple’s self-developed M1/M1 pro/M1 max processors built with TSMC’s 5nm technology have been a reason for Intel’s lost Macbook series orders in the past two years which, in turn, has encouraged more brand-named manufacturers to initiate Fabless development strategies. Companies such as Microsoft, Amazon, Google, Facebook, and Alibaba have all put forward self-developed ARM architecture solutions.
In 2020, Intel continuously spoke publicly stating that the company’s long-term core development strategy is gradually shifting from the old CPU processor business to xPU data computing services and, after revealing plans to outsource a portion of their CPU business, discussed plans to partner with TSMC. According to TrendForce’s investigations, Intel’s earlier non-CPU products such as FPGA, ASIC, RFIC, PMIC and Wi-Fi have already been outsourced to TSMC, UMC or Samsung. As of today, Intel has officially released orders for CPU products to TSMC. Discounting cooperation in existing product lines, the division of labor between Fabless and Foundry combined with TSMC-led OIP, DTCO and 3D Fabric services will provide Intel with a multitude of choices. In addition to maintaining their original IDM model, Intel can maintain a high-margin self-developed production line and appropriate capital investment while flexibly using TSMC’s production line to create additional diversified value and maintain a competitive advantage against competitors such as AMD.