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Monthly Archives: 六月 2022

Global Packaging and Testing Output Value Reached US$82.139 Billion in 2021, 25.83% YoY, China Becomes Fastest Growing Market

Posted on 2022-06-01 by TrendForce

According to TrendForce research, driven …

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Posted in Semiconductors, Wafer Foundries | Tagged advanced packaging, Amkor, ASE, IC packaging, TrendForce, wafer | Leave a comment
  • 近期文章

    • Global Packaging and Testing Output Value Reached US$82.139 Billion in 2021, 25.83% YoY, China Becomes Fastest Growing Market
    • Smartphone Panel Shipments Forecast to reach 1.872 billion in 2022, Chinese Companies Accounting for More Than 50%
    • China’s Lockdowns Erode Car Production and Sales, May Reduce Global Car Sales by 80 million units in 2022
    • Bucking Trends NEV Market Grew in 1Q22 with Global Sales Exceeding 2 Million Units, Says TrendForce
    • Lingering Pandemic Vexes Economic Performance, 2022 Smartphone Production Volume Reduced to 1.333 Billion Units, Says TrendForce
  • 近期迴響

    • Panel Costs Account for More Than 60% of 21.5-inch Monitor Retail Prices, with LCD Monitor Panel Prices Likely to Keep Rising 在 Panel Costs Account for More Than 60% of 21.5-inch Monitor Retail Prices, with LCD Monitor Panel Prices Likely to Keep Rising
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