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近期文章
- Global Packaging and Testing Output Value Reached US$82.139 Billion in 2021, 25.83% YoY, China Becomes Fastest Growing Market
- Smartphone Panel Shipments Forecast to reach 1.872 billion in 2022, Chinese Companies Accounting for More Than 50%
- China’s Lockdowns Erode Car Production and Sales, May Reduce Global Car Sales by 80 million units in 2022
- Bucking Trends NEV Market Grew in 1Q22 with Global Sales Exceeding 2 Million Units, Says TrendForce
- Lingering Pandemic Vexes Economic Performance, 2022 Smartphone Production Volume Reduced to 1.333 Billion Units, Says TrendForce
近期迴響
彙整
分類
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
其它
Monthly Archives: 六月 2022
Global Packaging and Testing Output Value Reached US$82.139 Billion in 2021, 25.83% YoY, China Becomes Fastest Growing Market
According to TrendForce research, driven …
Posted in Semiconductors, Wafer Foundries
Tagged advanced packaging, Amkor, ASE, IC packaging, TrendForce, wafer
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